Function

• Creation of a reliable thermal bridge
• Reduction of thermal contact resistance
• Compensation of tolerances between differing contact surfaces
• Damping of mechanical vibrations without transferring them to adjacent components

Technical Features

• Highly conductive copper material
• Consistent heat transfer even under dynamic operating conditions
• Manufacturing technology without loose wires
• High cleanliness and robust mechanical design

Optionally, the copper cushion can be used in combination with external temperature sensors to provide optimal thermal coupling for measurement points.

Structure and Material

• Material: High‑thermal‑conductivity copper
• Mechanically stable design for secure integration into mechatronic systems
• Manufacturing without free wire elements – increased operational safety

Applications

• Thermal management in mechatronic modules
• Automotive engineering
• Electronic and sensor systems
• Applications with combined thermal and mechanical requirements